AUROLECTROLESS™ SMT-250

Description:

AUROLECTROLESS™ SMT-250 is an immersion gold process for producing a uniform, fine-grained deposit of soft pure gold on metallic substrates like copper, nickel, and palladium.

Used in:

• For producing a uniform, fine-grained deposit of soft pure gold on metallic substrates like copper, nickel, and palladium
• For PWB metallization applications

Advantages:

• Excellent solderability
• Highly stable solution
• Uniform deposits
• Aluminum wire bondable when applied over nickel
• High tolerance to metallic contamination

Properties:

Typical Properties These properties are typical but do not constitute specifications.
AUROLECTROLESS SMT-250D
Color	White solid
AUROLECTROLESS SMT-250M
Specific gravity	~1.20
Color	Clear colorless to pale yellow liquid
pH	5.1-5.5
AUROLECTROLESS SMT-250R
Specific gravity	~1.03
Color	Clear colorless to pale yellow liquid
pH	7.0-8.0
AUROLECTROLESS SMT-250C
Specific gravity	~1.3
Color	Clear colorless to amber liquid
pH	5.1-5.5