InterVia photodielectrics from Rohm and Haas Electronic Materials are epoxy-based, negative-tone (broad band exposed) permanent materials designed for use on wafers and organic/inorganic substrates. InterVia photodielectrics are applied by spinning and, when properly cured, have a low dielectric constant (3.2 @ 1 Ghz) and moisture absorbance. NEW: InterVia Photodielectric 8023  | Advantages of InterVia Photodielectrics - Lower cost of ownership vs. BCB and PI (Polyimide)
- Low temperature cure (175°C @ 3 hours)
- Low shrinkage during cure (»12–15%)
- Low stress (1/2 of PI)
- Excellent adhesive characteristics for bonding applications
- Minimal moisture uptake
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Applications for InterVia Photodielectrics - Passivation Stress Buffer (PSB) / Die Top-Coat
- Redistribution Layer (RDL) – Dielectric
- Permanent Polymer Adhesive
- Through-Silicon Via (TSV) – Polymer Fill Metal Insulator
 TMAH Aqueous Developable Photodielectric
Developed as a negative-tone, photo-imageable insulation resin, InterVia Photodielectric 8023 meets industry process needs, such as redistribution of bond pads for wafer-level CSPs and device top coat protection. InterVia Photodielectric 8023 can be easily substituted for conventional materials, such as polyimide and BCB. Wide processing windows, low-shrinkage during cure and minimal moisture uptake eases processing and leads to improved yields. InterVia Photodielectric 8023 uses aqueous-based developers with no solvents. Learn more about InterVia Photodielectric 8023 Learn more about InterVia BP Developer  More information about InterVia Photodielectrics
For materials in this section, you will be required to fill out a brief form. Information will be available for immediate download. About the Advanced Packaging Portfolio 
Rohm and Haas Electronic Materials is a full-line supplier of photolithography, photodielectric and metallization materials for advanced semiconductor packaging. We provide for a wide range of applications, including wafer bumping, copper pillars, under bump metallization, redistribution, fan-out, passivation stress buffer, trench and via fill, and thru-silicon via. Many environmentally-friendly options are available. Rohm and Haas Electronic Materials focuses on delivering innovative products and processes that provide the best possible cost of ownership and environmentally-friendly options to the Advanced Packaging market. Our teams and manufacturing are positioned around the world close to our customers to provide the best service possible. For more information about our Advanced Packaging products: Photolithography Products Photodielectric Products Electroless Metallization Electrolytic Metallization Pretreatment | 
InterVia™ Photodielectrics