|
|
|
| DATE |
SHOW |
BOOTH NUMBER |
SHOW INFO |
|
| 2010 |
| 1ST QUARTER |
Feb. 23-March 2,
2010 |
EMC3D TSV Technology Symposium
Japan, Korea, Taiwan |
Technical Paper Presentors |
EMC3D TSV
Show Info |
March 2-5,
2010 |
3rd JPV Expo
Tokyo Big Sight, Japan |
Sharing Schmid Booth |
JPV EXPO Show Info |
March 9-11,
2010 |
IMAPS Device Packaging
Scottsdale, AZ
|
Booth #30 |
IMAPS Show Info |
March 16-18,
2010 |
Semicon China
Shanghai, China |
Hall W3, Booth # 3401 |
Semicon China
Show Info |
March 19-20,
2010 |
CSTIC China (in conjunction with Semicon China)
Shanghai, China |
Sponsorship - 5 papers to advertise |
CSTIC China
Conference Info |
March 22-26,
2010 |
INDUSTRIE Paris (SITS)
Paris Nord Villepinte, France |
Booth # 5, Hall 3 |
INDUSTRIE Paris
Show Info |
| |
|
|
|
| 2ND QUARTER |
April 1-4,
2010 |
CMP-MIC
Freemont, CA |
Date for reference Only |
CMP-MIC
Conference Info |
April 6-8,
2010 |
IPC Printed Circuits
Las Vegas, NV |
Booth # 419 |
IPC Show Info |
April 5-9,
2010 |
SPIE Defense, Security
& Sensing
Orlando, FL |
Booth # 1112 |
Conference Info |
April 25-30,
2010 |
ECS Spring (US)
Vancouver, CA |
Date for reference Only |
ECS Meeting Info |
| |
|
|
