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IMPACT ConferenceOutstanding Paper AwardOctober 2009
Electroplating Equipment Design Considerations for Copper Microvia Filling (pdf)
PCD&FAugust 2009
Meeting the challenges of the next generation HDI and packaging substrate (English) (pdf)
PCB007August 2008
Next Generation Electroplating for Microvia Plating (English) (pdf)
Next Generation Electroplating for Microvia Plating (简体中文) (pdf)
Next Generation Electroplating for Microvia Plating (繁體中文) (pdf)