IMPACT Conference
Outstanding Paper Award
October 2009

Electroplating Equipment Design Considerations for Copper Microvia Filling (pdf)

PCD&F
August 2009

Meeting the challenges of the next generation HDI and packaging substrate (English) (pdf)

PCB007
August 2008

Next Generation Electroplating for Microvia Plating (English) (pdf)

Next Generation Electroplating for Microvia Plating (简体中文) (pdf)

Next Generation Electroplating for Microvia Plating (繁體中文) (pdf)