MICROFILL™ EVF Copper Via Fill

MICROFILL™ EVF Copper Via Fill
Next Generation of Pattern Viafill Plating Technology

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The latest generation technology developed by Dow Electronic Materials for advanced via fill plating, MICROFILL™ EVF Via Fill provides enhanced via filling, with simultaneous through-hole plating, at surface thicknesses unattainable. Formulated to operate in existing equipment over a broad range of operating conditions, MICROFILL™ EVF Copper Via Fill is suitable for both HDI and IC substrate applications. It is proved by suffi cient experience that MICROFILL™ EVF could help to reduce 20% plating thickness and helps to improve varied plating defects.

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Advantages

Low plating thickness (20 μm)
Simultaneous microvia filling and through-hole plating at HDI application
Easily analyzed and controlled by conventional CVS
Rectangle trace profile for W/B application
Excellent reliability

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