The latest generation technology developed by Dow Electronic Materials for advanced via fill plating, MICROFILL™ EVF Via Fill provides enhanced via filling, with simultaneous through-hole plating, at surface thicknesses unattainable. Formulated to operate in existing equipment over a broad range of operating conditions, MICROFILL™ EVF Copper Via Fill is suitable for both HDI and IC substrate applications. It is proved by suffi cient experience that MICROFILL™ EVF could help to reduce 20% plating thickness and helps to improve varied plating defects.
Advantages
Low plating thickness (20 μm)
Simultaneous microvia filling and through-hole plating at HDI application
Easily analyzed and controlled by conventional CVS
