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With a broad range of core competencies in surface preparation, metallization, and imaging materials, Dow Electronic Materials, Interconnect Technologies, develops and delivers industry-leading processes and products for the printed circuit, electronic component, surface finishing, and solar energy industries.
Core Business
Dow Electronic Materials continues to bring new technologies to the market to support customers in the circuit board, electronic packaging and surface finishing industries. With a proven record of delivering high performance, cost effective products, we can help improve your process capabilities and their sustainability.
Application
Interconnect
- Final Finishes
- Inner Layer Bonding
- Liquid Photoresist
- Making Holes Conductive
- Electrolytic Plating
- DES/SES
Electronic Finishes (Components)
- Connector
- Semiconductor
- Passive
- TAB
Industrial Finishes
- Plating on Plastic
- General Metal Finish
- EMI Shielding
- Decorative Finishes
- Steel Mill
Photovoltaic Business
Dow Electronic Materials is currently developing new metallization and imaging technologies to help improve solar cell efficiencies and device yields. With our extensive global footprint and advanced technology processes for photovoltaic devices, we can help you build a bright future in solar cell manufacturing.
Application
Imaging
Metallization
Texturizing
Cleaning
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