About Dow Electronic Materials

Dow Electronic Materials, formerly Rohm and Haas Electronic Materials, is one of Dow Advanced Materials Division’s five core business groups. It was created by the company's acquisition of several companies including Shipley Company, LeaRonal Inc., Rodel Inc. and Morton International. Building on the history and leadership established by these companies, Dow Electronic Materials now comprises four business units: Semiconductor Technologies, Interconnect Technologies, Display Technologies, and Growth Technologies.

Today, Dow Electronic Materials maintains leading positions and strong market share in every segment in which it operates. Dow Electronic Materials is uniquely positioned in its ability to develop and deliver innovative products through its agile, independent business units:

• Semiconductor Technologies
  • Products used in semiconductor and related industries
  • Advanced photoresists, anti-reflectants, developers, electroplating chemistries, and related materials
  • Advanced pad and slurry technologies for planarizing and polishing semiconductors, silicon wafers, and storage media
  • Leading edge technology that supports the advancement of semiconductor device “shrinks”
• Interconnect Technologies
  • Enabling technologies in metallization and imaging  products used to manufacture high end printed circuit boards
  • Innovation that enables smaller, high-density and high-throughput circuit boards focusing on High-Density Interconnection and Integrated Circuit package substrate solutions
  • Metallization products used in the electronic component and industrial surface finishing markets
• Display Technologies
  • Large, growing market
  • Core technologies  
    1. Electrochemistry
    2. Particle Engineering
    3. Photochemistry 
    4. Polymer Technology
    5. Surface Science
  • Driven by technology differentiation
    1. Multi-functional films
    2. LED backlight-optimized films
    3. Display chemicals
• Growth Technologies
  • Materials used in advanced packaging of semiconductor Metallization, Lithography and Assembly
  • Advanced precursor materials used in chemical vapor and atomic layer deposition for semiconductor and compound semiconductor applications
  • Enabling materials for semiconductor processing
  • Materials for infrared, laser, thermal imaging and other optical applications