Circuitree Podcast - September 2009
Blind Microvia Filling and Dow Electronic Materials MICROFILL EVF Copper Via Fill product
Mark Lefebvre, Research Manager Dow Eletronic Materials mlefebvre@rohmhaas.com
Click here for the Podcast 中文版
CircuiTree Webinar University - December 9, 2008
Next generation Microvia filling process for HDI and IC packaging
Click here for the webinar.
