Electrolytic Copper Through Hole Fill for HDI
and IC Substrates
Mark Lefebvre
Senior Research & Development Manager

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Solutions for Copper Plating of High Aspect
Ratio Thick Printed Circuit Boards
Dennis Yee
R&D Director, Asia

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Soaring Gold Costs: Dow Immersion Gold
Innovation Fights Back
Martin Bayes
Research Fellow

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Blind Microvia Filling  and Dow Electronic Materials MICROFILL EVF Copper Via Fill product

Mark Lefebvre, Research Manager
Dow Eletronic Materials
mlefebvre@rohmhaas.com

Click here for the Podcast     中文版