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The Interconnect Technologies business unit serves
the printed circuit board, electronic finishing,
industrial finishing and photovoltaic markets.
Our advanced metallization technologies improves
performance of electronics and enables high-density
circuits, while creating reliable and durable industrial
finishes and increasing efficiency for solar cells.
Interconnect Technologies offers:
- Metallization and imaging technologies that
enables smaller and multi-functional printed circuit
boards
- Highly flexible electroplating technologies
which provide reliable surface finishing for electronic
components
- Plating technologies that improves appearance
and protection for industrial and consumer products
- Innovative
technologies which increases efficiency, yield
and throughput of solar cells
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