Productronica 2009 Feature Products

Dry Film Photoresist (pdf)

Electroless Nickel - Immersion Gold (pdf)

High Performance Copper Electroplating (pdf)

LITHOJET™ 210 Etch Resist (pdf)

CIRCUPOSIT™ 3000-1 (pdf)

TPCA 2009 Feature Products

Advanced Acid Copper Plating for Vertical Continuous Plater (pdf)

Next Generation of Pattern Viafill Plating Technology (pdf)

DC Copper Plating for HDI (pdf)

Desmear/Electroless Copper for Semi Additive Process (pdf)

Advanced Conditioner in PTH Process (pdf)

Circuposit™ 4000 Horizontal Desmear/PTH (pdf)

Universal Electroless Copper (pdf)

Vertical Advanced Desmear / PTH (pdf)

Imaging - 3D Photoresist Technology (pdf)

Inner Layer Bonding Technology (pdf)

Final Finishing - ENIG and ENEPIG Technology (pdf)

High Resolution Fine Line Imaging Technology (pdf)