Circuitex 2011 Featured Products

High Desmear Performance & Cost Effective Advanced Sweller (pdf)

Next Generation of Pattern Viafill Plating Technology (pdf)

DC Copper Plating for Thick Panel (pdf)

Desmear/Electroless Copper for Semi Additive Process (pdf)

Advanced Solution for Vertical-in-Line Equipment (pdf)

Final Finishing — ENEPIG Technology (pdf)

Green Products (pdf)

Green Spray Type Cleaner (pdf)

High Performance and Cost Effective ENIG (pdf)

Horizontal Desmear / PTH (pdf)

Innovative Final Finish — Autocatalytic Silver Immersion Gold (pdf)

Innovative Inkjet Printing Resist (pdf)

IPC/APEX 2011 Featured Products

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HKPCA 2010 Featured Products

About Interconnect Technologies (pdf)

Advanced Solution for Vertical-in-Line Equipment (pdf)

DC Copper Plating for Thick Panels (pdf)

Desmear/Electroless Copper for SemiAdditive Process (pdf)

Final Finishing ENEPIG Technology (pdf)

Final Finishing ENIG Technology (pdf)

Green Products (pdf)

High Desmear Performance & Cost Effective Advanced Sweller (pdf)

Innovative Final Finish - Autocatalystic Silver Immersion Gold (pdf)

Next Generation of Pattern Viafill Plating Technology (pdf)

TPCA 2010 Featured Products

Advanced Solution for Vertical-in-Line Equipment (pdf)

DC Copper Plating for Thick Panel (pdf)

Desmear Electroless Copper for Semi Additive Process (pdf)

Final Finishing-ENEPIG Technology (pdf)

Final Finishing-ENIG Technology (pdf)

Green Products (pdf)

High Desmear Performance & Cost Effective Advanced Sweller (pdf)

Inner Layer Bonding Technology (pdf)

Innovative Final Finish-Autocatalytic Silver Immersion Gold (pdf)

Innovative Inkjet Printing Resist (pdf)

Next Generation of Pattern Viafill Plating Technology (pdf)

Universal Electroless Copper & Horizontal Desmear PTH (pdf)

IPC 2010 Featured Products (new browser window)

Productronica 2009 Feature Products

Dry Film Photoresist (pdf)

Electroless Nickel - Immersion Gold (pdf)

High Performance Copper Electroplating (pdf)

LITHOJET™ 210 Etch Resist (pdf)

CIRCUPOSIT™ 3000-1 (pdf)

TPCA 2009 Feature Products

Advanced Acid Copper Plating for Vertical Continuous Plater (pdf)

Next Generation of Pattern Viafill Plating Technology (pdf)

DC Copper Plating for HDI (pdf)

Desmear/Electroless Copper for Semi Additive Process (pdf)

Advanced Conditioner in PTH Process (pdf)

Circuposit™ 4000 Horizontal Desmear/PTH (pdf)

Universal Electroless Copper (pdf)

Vertical Advanced Desmear / PTH (pdf)

Imaging - 3D Photoresist Technology (pdf)

Inner Layer Bonding Technology (pdf)

Final Finishing - ENIG and ENEPIG Technology (pdf)

High Resolution Fine Line Imaging Technology (pdf)